High Density Interconnect PCB

High Density Interconnect PCB Designs are used for applications that require high component density such as smartphones, tablets, wearables, digital cameras and other consumer electronics. Other applications include infotainment systems, advanced driver assistance systems (ADAS) and vehicle control units that are required to cram components in a small space while maintaining power quality and weight efficiency.

The process of creating an high density interconnect circuit board is a complex multi-step one involving plating vias, filling them with various types of material, capping them and then depositing a layer of metal over the top. A key component of the production process is via-in-pad, a technology that allows you to place vias on flat lands on the PCB, rather than drilling holes through the entire board. This can reduce the size of a PCB and help with thermal management by providing one of the shortest ways to bypass capacitors for high-frequency design.

Compared to traditional PCBs, HDI circuit boards have a much higher wiring density with finer track arrangements that allow for smaller vias and less congestion. These features improve signal transmission, reduce crossing delays and provide better electrical performance. Using these technologies also increases the number of components that can fit on a single circuit board, making it possible to create compact and lightweight products that would otherwise require multiple traditional boards.

High Density Interconnect PCB Designs

When selecting the components for an HDI circuit board, careful consideration must be given to the package types, routing widths, location and type of vias – both blind and buried. This will determine the layout and stack-up that can be achieved, as well as the routing congestion, component density and the number of sequential layers required to make up the PCB.

Another important factor when designing an HDI circuit board is the selection of materials. There are many options to choose from, including FR4, copper-filled stacked microvias, fine line and space, and sequential lamination. The choice of materials can impact the thickness of the core, the number of layers and the cost.

The number of layers and the type of via structure can have a significant impact on the price of a high-density interconnect circuit board. The more layers and the smaller the vias, the more expensive the PCB will be. In addition, the selection of a 2-n-2 versus 1-n-1 construction can significantly increase or decrease the price. It is recommended that you discuss your design with a qualified circuit board manufacturer to find the best option for your application. Choosing a partner with expertise in the latest PCB fabrication techniques and manufacturing technologies can ensure that you have the right solution at a competitive price. Contact us to learn more about how we can help with your next PCB project. We offer a wide range of services, including PCB Custom Design, Layout and Analysis, Library Management, Power Integrity and Structural Analysis. Our experienced team of engineers can help you find the right solution for your needs. Request a quote today!